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Recommended Papers for: electronics

Total Papers Found: 14

Percolation based enhancement in effective thermal conductivity of HDPE/LBSMO composites

La0.7Ba0.15Sr0.15MnO3 (LBSMO) powder was prepared and mixed with HDPE powder in volume fractions from 0 to 0.30. These powders were then molded into pellet form in a hot press and cooled to room temperature. The thermal conductivity of the resulting composite was then measured using the transient plane source method. It was found that the thermal conductivity of the composite samples increased with increasing LBSMO content up to an ...

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Direct Low-Temperature Integration of Nanocrystalline Diamond with GaN Substrates for Improved Thermal Management of High-Power Electronics

This study aimed to develop a new technique for thermal management in high powered gallium nitride (GaN) electronic and optoelectronic devices. The researchers integrated GaN with diamond through the process of depositing high-quality nanocrystalline diamond films directly onto the GaN material at temperatures between 450-500°C. Highly controlled growth conditions for the diamond ensured that it was of good quality. Thermal conductivity measurements using the laser flash method were performed ...

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Properties of graphene produced by the high pressure-high temperature growth process

In this article, the authors present a novel method for the synthesis of graphene layers that can be used in advanced electronic devices, among other applications. The preparation method involves the use of a high-pressure high-temperature process where the pressure and temperature are closely monitored in order to preferentially prepare graphene layers. The quality of the material synthesized is much better than previously reported, and the size of the layers ...

Author(s): , , , , , ,

Parameter Optimization for Measuring Thermal Properties of Electronic Materials using the Transient Plane Source Technique

In the electronic industry, manufacturers depend on accurate thermal conductivity testing methods to characterize their new products, and perform quality control maintenance on continuing materials. This paper assesses the ability of the Transient Plane Source (TPS) technique to accurately characterize newly developed materials, for their use in novel electronic applications. Using the TPS technique, various silicone based electronic materials, of differing filler contents, were thermally characterized and examined for their ...

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