Category: Transient Plane Source
Author(s): Craig Dixon, Michael R. Strong, S. Mark Zhang
Keywords: automotive electronics, characterization, chip scale packaging, electronics, Fillers, parameter selection, quality control, sample preparation, sample size, sensor selection, Silicone, Thermal Conductivity, thermophysical, TPS, Transient Plane Source, Transient plane source (TPS) method
Abstract: In the electronic industry, manufacturers depend on accurate thermal conductivity testing methods to characterize their new products, and perform quality control maintenance on continuing materials. This paper assesses the ability of the Transient Plane Source (TPS) technique to accurately characterize newly developed materials, for their use in novel electronic applications. Using the TPS technique, various silicone based electronic materials, of differing filler contents, were thermally characterized and examined for their possible introduction to electronic materials. The results concluded the TPS technique to be a reputable and rapid method for performing quality control testing, as well as thermally characterizing novel electronic materials.