In the electronic industry, manufacturers depend on accurate thermal conductivity testing methods to characterize their new products, and perform quality control maintenance on continuing materials. This paper assesses the ability of the Transient Plane Source (TPS) technique to accurately characterize newly developed materials, for their use in novel electronic applications. Using the TPS technique, various silicone based electronic materials, of differing filler contents, were thermally characterized and examined for their ...
This research paper delves into the thermal conductivity monitoring of silicone-based electronic materials with various fillers, using the Transient Plane Source (TPS) technique. Aside from the results, researchers also highlight the main features of the TPS technique: a rapid, precise and non-invasive method for measuring thermal properties of various materials. The results received using the TPS technique match those received using other techniques, however when using the TPS technique 30 tests ...
