Thermal interface materials (TIMs) are often used in electronic and microelectronic applications. It can be difficult to determine their characteristics once they are in-situ because it is hard to account for the surface roughness and waviness of the objects the TIM is applied to. This paper explores the application and design of a guarded heat flow meter apparatus that complies with all standards in ASTM D 5470-95 that can accurately ...
Thermal adhesives that contain large proportions of high thermal conductivity filler materials are extremely useful in electronics and manufacturing. Due to the importance of these fillers it is crucial to know their exact properties. Five adhesives are examined for their thermal conductivities. These values were obtained using a guarded heat flow meter with a method following the ASTM test standard. This method ...
In this study, thermal behaviors of an integrated thermal management system (ITMS) with phase change materials (PCMs) and air conditioning exhaust are examined. To enhance thermal conductivity of the PCM, copper foam and paraffin were added. Thermal conductivity of the composite PCM was measured by a thermal analyzer, based on the transient plane source method....
Polymeric composite materials were prepared by one-pot synthesis of chromophoric polymer phase change material in nitrogen-doped porous carbon (NPC). Thermal conductivity was found to increase with increasing NPC wt%, enhancing the heating rate with a shorter phase change period....
An oscillating heat pipe (OHP) is a pipe that transports heat from the evaporator to the condenser via a complex pulsating action. Nanofluids and self-wetting fluids can be used to improve the heat transport capabilities of the OHPs. This study looks at heat transport performances of OHP with different binary fluids. Thermal conductivity was measured using a thermal analyzer, with transient plane source method. Nanofluids were found to have a ...
