Parameter Optimization for Measuring Thermal Properties of Electronic Materials using the Transient Plane Source Technique
Author(s): Craig Dixon, Michael R. Strong, S. Mark Zhang
In the electronic industry, manufacturers depend on accurate thermal conductivity testing methods to characterize their new products, and perform quality control maintenance on continuing materials. This paper assesses the ability ...
Keywords: automotive electronics, characterization, chip scale packaging, electronics, Fillers, parameter selection, quality control, sample preparation, sample size, sensor selection, Silicone, Thermal Conductivity, thermophysical, TPS, Transient Plane Source, Transient plane source (TPS) method
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