Thermal Conductivity Paper Database

Search academic papers below:

Recommended Papers for: electronics

Total Papers Found: 14

Preparation and thermal property analysis of Wood’s alloy/expanded graphite composite as highly conductive form-stable phase change material for electronic thermal management

Using phase change materials (PCMs) for passive cooling is an effective thermal management technique as they absorb and release large amount of latent heat. However, PCMs have low thermal conductivity and liquid leakage often occurs after the solid-liquid phase transitions. In this study, a Wood’...

Author(s): , , , , ,

Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board

Mechanical flexibility, low cost, and lightweight design are crucial elements for high demand electronic devices and has increased the application of flexible printed circuit board (FPCB). However, FPCB exhibits stress under operating conditions compared to rigid printed circuit board (RPCB), and was studied to investigate ...

Author(s): , , ,

Tailoring Ca3Co4O9 microstructure and performances using a transient liquid phase sintering additive

Research has been focused on the Co-based thermoelectric family since the discovery of thermoelectric properties in NaCo₂O₄ ceramics. The formation of strong grain boundaries has been achieved in several ceramic materials through the addition of metallic Ag, forming the liquid phase. In the case ...

Author(s): , , , , , , , , , ,

Quantification of free convection for embarked QFN64 electronic package: An experimental and numerical survey

Aeronautics safety strongly depends on the Quad Flat Non-Lead (QFN) reliability, whose junction temperature must remain as low as possible during operation. The power must remain below 0.1W, making the QFN64 model most relevant under these operating conditions. This study aims at improving the thermal ...

Author(s):

Thermal design of a sensor for building control equipped with QFN electronic devices subjected to free convection. Effects of the encapsulating resin

Quad Flat Non-Lead (QFN) devices are sensors used in building designs to control electronic equipment. The temperature of the QFN sometimes exceeds its maximum threshold, which this is primarily due to the encapsulating resin. In this study, the thermal conductivity of the resin was tested ...

Author(s): , , , ,

Linkedin