Mechanical flexibility, low cost, and lightweight design are crucial elements for high demand electronic devices and has increased the application of flexible printed circuit board (FPCB). However, FPCB exhibits stress under operating conditions compared to rigid printed circuit board (RPCB), and was studied to investigate the effects of airflow rate and heat on FPCB attached with a ball grid array (BGA) package. Thermal conductivity and specific heat were measured using ...
Using phase change materials (PCMs) for passive cooling is an effective thermal management technique as they absorb and release large amount of latent heat. However, PCMs have low thermal conductivity and liquid leakage often occurs after the solid-liquid phase transitions. In this study, a Wood’s alloy/expanded graphite composite PCM was developed to achieve desirable thermal performance. The thermal conductivities of the composite samples were measured, based on a ...
Research has been focused on the Co-based thermoelectric family since the discovery of thermoelectric properties in NaCo₂O₄ ceramics. The formation of strong grain boundaries has been achieved in several ceramic materials through the addition of metallic Ag, forming the liquid phase. In the case of Ca₃Co₄O₉ ceramic materials, it is essential to find a comparable additive. In this study, K₂CO₃ is analyzed as liquid phase promoter ...
Aeronautics safety strongly depends on the Quad Flat Non-Lead (QFN) reliability, whose junction temperature must remain as low as possible during operation. The power must remain below 0.1W, making the QFN64 model most relevant under these operating conditions. This study aims at improving the thermal design and reliability of the QFN64 device for embarked electronics. Numerical results are confirmed by thermal and electrical measurements carried out on prototypes for all ...
Quad Flat Non-Lead (QFN) devices are sensors used in building designs to control electronic equipment. The temperature of the QFN sometimes exceeds its maximum threshold, which this is primarily due to the encapsulating resin. In this study, the thermal conductivity of the resin was tested for the QFN16b, QFN32b, and QFN64b using the Transient Plane Source (TPS). Power levels between 0.1 W and 1.0 W were administered through the ...
