Category: Transient Plane Source
Keywords: boron nitride, coefficient of thermal expansion, Coefficient of thermal expansion (CTE), CTE, Diamond, Epoxy, FE-SEM, Fillers, films, Particle Size Analyzer, Polymer composites, Scanning Electron Microscopy, Scanning Electron Microscopy (FE-SEM), TEM, TGA, Thermal Conductivity, Thermogravimetric Analysis, Thermogravimetric analysis (TGA), thin films, Transmission electron microscopy, Transmission electron microscopy (TEM)
Abstract: The effects of the addition of three different fillers to a polymer matrix on the thermo-physical properties of the resulting composites were investigated by the authors. Boron nitride, synthetic diamond, and silicon nitride were used as the fillers (up to 2 vol. %), and it was found that their addition did increase the thermal conductivity relative to that of the pure epoxy matrix. Furthermore, it was determined that the thermal conductivities of the composites increased with increasing filler content, and the maximum thermal conductivity observed in the composites prepared in this work was 78 % higher than that of the pure epoxy matrix. The synthetic diamond filled composites were found to be more thermally stable than the other two types of composites; however, they were found to absorb more moisture than the other composites.
Reference: Polymers for Advanced Technologies, 23, 12 (2012) 1620-1627