Thermal Conductivity Paper Database

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Recommended Papers for: films

Total Papers Found: 23

“Graphene-Like” Exfoliation of Atomically-Thin Films of Bi2Te3 and Related Materials: Applications in Thermoelectrics and Topological Insulators

This article examined the properties of bismuth telluride (Bi2Te3) after “graphene-inspired” exfoliation left its crystalline films with a thickness of a few atoms. The thermal conductivities were found using the transient plane source (TPS) technique and the laser-flash method. An ...

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An improved transient plane source method for measuring thermal conductivity of thin films: Deconvoluting thermal contact resistance

This study experiments with the new and improved transient plane source (TPS) method for measuring the thermal conductivity of thin-films. The existing TPS method for measuring thin-films experiences the effect of thermal contact resistance. In this experiment, a thermal constants analyzer is used to investigate ...

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Using transient plane source sensor for determination of thermal properties of vacuum insulation panels

Researchers at the Chalmers University of Technology used the transient plane source (TPS) method to propose a technique for testing layered materials of a low conductive core, coated in a highly conductive thin film. The accuracy of the method to evaluate isotropic materials was tested ...

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Thermal properties and moisture absorption of nanofillers-filled epoxy composite thin film for electronic application

The effects of the addition of three different fillers to a polymer matrix on the thermo-physical properties of the resulting composites were investigated by the authors. Boron nitride, synthetic diamond, and silicon nitride were used as the fillers (up to 2 vol. %), and it was found ...

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Thermal conduction through diamond – silicon heterostructures

The thermal conductivity and thermal boundary resistance between ultrananocrystalline diamond (UNCD) and microcrystalline diamond (MCD) films on silicon wafers were evaluated. It was found that the MCD/Si composite wafers were more thermally conductive than the UNCD/Si wafers over the temperature range tested. It ...

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