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Recommended Papers for: films

Total Papers Found: 23

“Graphene-Like” Exfoliation of Atomically-Thin Films of Bi2Te3 and Related Materials: Applications in Thermoelectrics and Topological Insulators

This article examined the properties of bismuth telluride (Bi2Te3) after “graphene-inspired” exfoliation left its crystalline films with a thickness of a few atoms. The thermal conductivities were found using the transient plane source (TPS) technique and the laser-flash method. An instrument was used for obtaining the thermal conductivity with the TPS technique. It was found that the exfoliated thin films have low thermal conductivity, relatively ...

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An improved transient plane source method for measuring thermal conductivity of thin films: Deconvoluting thermal contact resistance

This study experiments with the new and improved transient plane source (TPS) method for measuring the thermal conductivity of thin-films. The existing TPS method for measuring thin-films experiences the effect of thermal contact resistance. In this experiment, a thermal constants analyzer is used to investigate the precision and efficacy of the new method. This modified method looks to resolve the issues surrounding contact resistance, with eliminating the need for reference ...

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Using transient plane source sensor for determination of thermal properties of vacuum insulation panels

Researchers at the Chalmers University of Technology used the transient plane source (TPS) method to propose a technique for testing layered materials of a low conductive core, coated in a highly conductive thin film. The accuracy of the method to evaluate isotropic materials was tested prior to testing the ability of the TPS to analyze layered materials. Value differences were noted between the simulated and the measured temperature increases of ...

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Thermal properties and moisture absorption of nanofillers-filled epoxy composite thin film for electronic application

The effects of the addition of three different fillers to a polymer matrix on the thermo-physical properties of the resulting composites were investigated by the authors. Boron nitride, synthetic diamond, and silicon nitride were used as the fillers (up to 2 vol. %), and it was found that their addition did increase the thermal conductivity relative to that of the pure epoxy matrix. Furthermore, it was determined that the thermal conductivities of ...

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Thermal conduction through diamond – silicon heterostructures

The thermal conductivity and thermal boundary resistance between ultrananocrystalline diamond (UNCD) and microcrystalline diamond (MCD) films on silicon wafers were evaluated. It was found that the MCD/Si composite wafers were more thermally conductive than the UNCD/Si wafers over the temperature range tested. It was also found that in both types of composite wafer, the thermal conductivity increased with temperature in contrast to the decrease that is observed in ...

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