In this study, some of the most commonly used measurement techniques for thermal conductivity and interfacial contact resistance of bulk and thin film materials are analyzed. For thermal analysis of bulk materials, the laser flash diffusivity method, the steady-state absolute method, comparative technique, and transient plane source (TPS) method are most used. The absolute and comparative technique allow for large sample sizes to be measured, but requires the longest time ...
The effects of the addition of three different fillers to a polymer matrix on the thermo-physical properties of the resulting composites were investigated by the authors. Boron nitride, synthetic diamond, and silicon nitride were used as the fillers (up to 2 vol. %), and it was found that their addition did increase the thermal conductivity relative to that of the pure epoxy matrix. Furthermore, it was determined that the thermal conductivities of ...
As electronics get smaller and more powerful, the components within them that handle heat dissipation must also evolve. Increasing power density and rising hot spots must be accouted for and handled. In this PhD dissertation, the author studies materials for potential use as heat spreaders or insulators at the nanoscale to understand their thermal properties. Nanostructured superlattices have shown to be highly effective in reducing the thermal conductivity of heat ...
Currently, there is no research into the accuracy of the transient plane source (TPS) method for measuring the thermal conductivity of thin films. The purpose of this study is to use numerical simulation to determine the accuracy of thermal conductivity measurements of thin films, with the TPS method. The values produced from the TPS method closely resembled those of the numerical simulation. The deviations from the numerical model were caused ...
