In this study, some of the most commonly used measurement techniques for thermal conductivity and interfacial contact resistance of bulk and thin film materials are analyzed. For thermal analysis of bulk materials, the laser flash diffusivity method, the steady-state absolute method, comparative technique, and transient ...
The effects of the addition of three different fillers to a polymer matrix on the thermo-physical properties of the resulting composites were investigated by the authors. Boron nitride, synthetic diamond, and silicon nitride were used as the fillers (up to 2 vol. %), and it was found ...
As electronics get smaller and more powerful, the components within them that handle heat dissipation must also evolve. Increasing power density and rising hot spots must be accouted for and handled. In this PhD dissertation, the author studies materials for potential use as heat spreaders ...
Currently, there is no research into the accuracy of the transient plane source (TPS) method for measuring the thermal conductivity of thin films. The purpose of this study is to use numerical simulation to determine the accuracy of thermal conductivity measurements of thin films, with ...
