In this study, sintering parameters in conventional pressure-less sintering are analyzed and the effects of uncoated, Cu(Ni)-coated, and Cr-coated diamond particles are compared for their bulk thermal conductivities. Thermal conductivity was measured at room temperature using a Thermal Constant Analyzer. The addition of ...
The effects of the addition of three different fillers to a polymer matrix on the thermo-physical properties of the resulting composites were investigated by the authors. Boron nitride, synthetic diamond, and silicon nitride were used as the fillers (up to 2 vol. %), and it was found ...
Diamond is an extremely conductive material that would be ideal for dissipating heat in microelectronics if it were not for its high price tag. In this study, cost effective copper- and chromium-diamond composites (uncoated (Cu/D), Cu-coated (Cu/CuD), and Cr-coated (Cu/CrD)) were produced ...
As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a thermal constants analyzer measured the thermal conductivities of eight different epoxy resin thermal adhesives using the transient plane source (TPS) method. Results ...
