Thermal properties and moisture absorption of nanofillers-filled epoxy composite thin film for electronic application
Author(s): L. C. Sim, M. Mariatti, Richard Voo
The effects of the addition of three different fillers to a polymer matrix on the thermo-physical properties of the resulting composites were investigated by the authors. Boron nitride, synthetic diamond, ...
Keywords: boron nitride, coefficient of thermal expansion, Coefficient of thermal expansion (CTE), CTE, Diamond, Epoxy, FE-SEM, Fillers, films, Particle Size Analyzer, Polymer composites, Scanning Electron Microscopy, Scanning Electron Microscopy (FE-SEM), TEM, TGA, Thermal Conductivity, Thermogravimetric Analysis, Thermogravimetric analysis (TGA), thin films, Transmission electron microscopy, Transmission electron microscopy (TEM)
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