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  - Column 1
    - HFM-100Heat Flow Meter
    - TLS-100Transient Line Source
    - THW-L1Transient Hot Wire
    - THW-L2Transient Hot Wire
    - GHFM-02Guarded Heat Flow Meter
    - TPS-EFFTransient Plane Source
  - Column 2
    - TPSTransient Plane Source
  - Column 3
    - DSC-L600Differential Scanning Calorimeter
    - TGA-1000Thermogravimetric Analyzer
    - TGA-1500Thermogravimetric Analyzer
- Category
  - Thermophysical Analysis
    - Heat Flow Meter, HFM-100Integrated Temperature & Automation
    - Transient Hot Wire, THW-L1 & THW-L2Thermal Conductivity, Thermal Diffusivity & Specific Heat
    - Transient line Source, TLS-100Thermal Conductivity & Thermal Resistivity
  - Thermal Analysis
    - Differential Scanning Calorimeter, DSC-L600Heat Flow, TG, Specific Heat
    - Thermogravimetric Analyzer, TGA-1000 & TGA-1500Integrated Temperature & Automation
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  - Solids
    - HFM-100Homogeneous & Heterogeneous Insulation
    - TLS-100Concrete, Rocks, Polymers
    - GHFM-02Homogeneous, Heterogeneous, Metals & Composites
  - Liquids
    - THW-L1Liquids, Temperature & Pressure
    - THW-L2Liquids, Temperature & Pressure
  - Pastes
    - TLS-100Paste up to 5 W/mK
    - THW-L1Paste up to 2 W/mK
    - THW-L2Paste up to 2 W/mK
    - GHFM-02Paste up to 15 W/mK
  - Powders
    - TLS-100Soil, Small to Medium Particle Size
- Material Characteristics
  - Isotropic / Homogeneous
    - HFM-100Insulation and Construction Materials
    - TLS-100Soil, rock & polymers
    - THW-L1All Liquids
    - THW-L2All Liquids
    - GHFM-02Composites & polymers
    - TPS-EFFTextiles, fabrics & solids
  - Heterogeneous
    - HFM-100Large sample size
    - GHFM-02Medium sample size
    - TPS-EFFMedium sensor for medium sample volume
  - Anisotropic
    - HFM-100Out-of-plane
    - GHFM-02Out-of-plane
    - TPS-EFFOut-of-plane
- ASTM/ISO/EN
  - Column 1
    - HFM-100ASTM C518-17, ISO 8301:1991, EN 12667
    - TLS-100ASTM D7896-14, IEEE 4442-1981
    - THW-L1ASTM D7896-19
    - THW-L2ASTM D7896-19
    - GHFM-02ASTM E1530-19
    - TPS-EFFASTM D7984-16
  - Column 2
    - DSC-L600ASTM/ISO
    - TGA-1000ASTM/ISO
    - TGA-1500ASTM/ISO
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Keyword: Diamond

Total Papers Found: 4

Optimization of sintering parameters for diamond-copper composites in conventional sintering and their thermal conductivity

Author(s): Fazal Ahmad Khalid, Kabeer Raza

In this study, sintering parameters in conventional pressure-less sintering are analyzed and the effects of uncoated, Cu(Ni)-coated, and Cr-coated diamond particles are compared for their bulk thermal conductivities. ...

Keywords: composite, Conventional sintering, Copper, Densification, Diamond, porosity, Thermal Conductivity, Transient plane source (TPS)

Thermal properties and moisture absorption of nanofillers-filled epoxy composite thin film for electronic application

Author(s): L. C. Sim, M. Mariatti, Richard Voo

The effects of the addition of three different fillers to a polymer matrix on the thermo-physical properties of the resulting composites were investigated by the authors. Boron nitride, synthetic diamond, ...

Keywords: boron nitride, coefficient of thermal expansion, Coefficient of thermal expansion (CTE), CTE, Diamond, Epoxy, FE-SEM, Fillers, films, Particle Size Analyzer, Polymer composites, Scanning Electron Microscopy, Scanning Electron Microscopy (FE-SEM), TEM, TGA, Thermal Conductivity, Thermogravimetric Analysis, Thermogravimetric analysis (TGA), thin films, Transmission electron microscopy, Transmission electron microscopy (TEM)

Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites

Author(s): Fazal Ahmad Khalid, Kabeer Raza, Muhammad Zain-ul-abdein, Tarek Mabrouki

Diamond is an extremely conductive material that would be ideal for dissipating heat in microelectronics if it were not for its high price tag. In this study, cost effective copper- ...

Keywords: Coatings, Copper, Cu/D composites, Diamond, Hasselman-Johnson model, Temperature, Thermal Conductivity, Thermal management systems, Thermal Resistance, thermal transport properties, Transient plane source (TPS) method, Volume

Thermal conductivity enhancement with different fillers for epoxy resin adhesives

Author(s): Dong-Chuan Mo, Shu-Shen Lu, Yuan-Xiang Fu, Zhuo-Xian He

As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a Hot Disk TPS-2500 thermal constants analyzer measured ...

Keywords: aluminum, Aluminum oxide, boron nitride, Copper, Diamond, Epoxy, Fillers, graphite, Heat dispersion, Metals, Powder shape, Powders, resin, Scanning Electron Microscopy (SEM), Silver, Thermal Adhesives, Thermal Conductivity, thermal transport properties, TPS 2500, Transient plane source (TPS), Transient plane source (TPS) method, Zinc oxide

Keyword: Diamond

Optimization of sintering parameters for diamond-copper composites in conventional sintering and their thermal conductivity

Thermal properties and moisture absorption of nanofillers-filled epoxy composite thin film for electronic application

Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites

Thermal conductivity enhancement with different fillers for epoxy resin adhesives

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