In the present study, boron nitride/dicyclopentadiene bisphenol cyanate ester/bisphenol A dicyanate ester (BN/DCPDCE/BADCy) composites were investigated for the effects of filler mass on thermal and mechanical properties. Thermal conductivity was measured using an instrument by transient plane source method. With the addition of BN fillers for BN/DCPDCE/BADCy composites, the BN-BN connections of inner composites increased and formed more thermally conductive channels, resulting in improved ...
In efforts to develop polymers possessing high thermal conductivity, ultra-high-molecular-weight polyethylene (UHMWPE)/boron nitride particles (BNp), UHMWPE/BN sheets (BNs), and UHMWPE/(BN+MWCNT) hybrid filler composites were analyzed in this study. Thermal conductivity was measured using the transient plane source (TPS) method. Results show that conductive pathways were formed in the composites, increasing both the connection between particles and the thermal conductivity. BNp-filled UHMWPE composites had an overall higher ...
Thermal conductivity of neat-epoxy resin is one of the lowest among all known solid materials. A common method of increasing thermal conductivity is through the addition of filler particles with high thermal conductivity. In this study, epoxy resin composites were studied to assess the possibility of increasing thermal conductivity for effective heat dissipation. A typical industrial liquid epoxy was used with commercial boron nitride powders PT100 and PTX25 as fillers. ...
In this paper, polyamide (PA, composed of at least 60% renewable materials) was used as a polymer matrix to prepare PA-hexagonal boron nitride (hBN) polymer composites with varying hBN contents. Two different PA samples were used in this study: a low viscosity grade PA (PA-30), as well as a high viscosity grade PA (PA-90). The composite polymers were tested to evaluate their thermal, physical, and mechanical properties. It was concluded that ...
The effects of the addition of three different fillers to a polymer matrix on the thermo-physical properties of the resulting composites were investigated by the authors. Boron nitride, synthetic diamond, and silicon nitride were used as the fillers (up to 2 vol. %), and it was found that their addition did increase the thermal conductivity relative to that of the pure epoxy matrix. Furthermore, it was determined that the thermal conductivities of ...
