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Recommended Papers for: chip scale packaging

Total Papers Found: 1

Parameter Optimization for Measuring Thermal Properties of Electronic Materials using the Transient Plane Source Technique

In the electronic industry, manufacturers depend on accurate thermal conductivity testing methods to characterize their new products, and perform quality control maintenance on continuing materials. This paper assesses the ability of the Transient Plane Source (TPS) technique to accurately characterize newly developed materials, for their use in novel electronic applications. Using the TPS technique, various silicone based electronic materials, of differing filler contents, were thermally characterized and examined for their ...

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