Category: Transient Plane Source
Author(s): Hani E. Naguib, Shahriar Ghaffari Mosanenzadeh
Keywords: BN, boron nitride, density, electronic packaging, Fillers, Polymer composites, Scanning Electron Microscope, Scanning electron microscope (SEM), SEM, Thermal Conductivity, transient plane source method, Void Fraction
Abstract: Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was determined that although thermal conductivity increased with increasing filler content, it was not necessarily due to the increased number of filler particles present, but rather the increased ability of these particles to interact with one another. It was found that the hexagonal boron nitride fibers forming networks increased the thermal conductivity when compared with composites containing uniformly dispersed filler particles.
Reference: Composites: Part B, 85 (2016) 24-30
DOI: 10.1016/j.compositesb.2015.09.021