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Effect of filler arrangement and networking of hexagonal boron nitride on the conductivity of new thermal management polymeric composites

Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was determined that although thermal conductivity increased with increasing filler content, it was not necessarily due to the increased number of filler particles present, but rather ...

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