Thermal Conductivity Paper Database

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Recommended Papers for: electronic packaging

Total Papers Found: 4

Rheology and Thermal Conductivity of Diamond Powder-Filled Liquid Epoxy Encapsulants for Electronic Packaging 

Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm resulted in a thermal conductivity of 4.1 W/m·K which is a substantial increase in ...

Author(s): , , , , , ,

Effect of processing technique on the transport and mechanical properties of vapour grown carbon nanofibre/rubbery epoxy composites for electronic packaging applications

Electronics packaging is fast paced area of research as scientists work to keep up with the new demands of smaller, more powerful electronic devices. In this study, researchers looked at how the manufacturing technique used to create vapour grown carbon nanofiber  (VGCNF)/rubbery epoxy composites ...

Author(s): , ,

Effect of filler arrangement and networking of hexagonal boron nitride on the conductivity of new thermal management polymeric composites

Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was ...

Author(s): ,

Rapid thermal conductivity measurement with a sensor: Part 2. Characterization of thermal greases

The transient plane source method was used to perform thermal conductivity, thermal diffusivity, and specific heat capacity measurements. Thermal transport properties of several thermal greases were characterized using TPS and data were compared to supplier data, received by other methods, to determine accuracy of the ...