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Keyword: electronic packaging

Total Papers Found: 2

Rheology and Thermal Conductivity of Diamond Powder-Filled Liquid Epoxy Encapsulants for Electronic Packaging 

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Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 ┬Ám ...

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Effect of filler arrangement and networking of hexagonal boron nitride on the conductivity of new thermal management polymeric composites

Author(s): ,

Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce ...

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