Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm resulted in a thermal conductivity of 4.1 W/m·K which is a substantial increase in comparison to the thermal conductivity of the pure epoxy. The electronic device junction temperature between a Si PiN diode chip and a 64 vol. % diamond-epoxy flowable ...
Electronics packaging is fast paced area of research as scientists work to keep up with the new demands of smaller, more powerful electronic devices. In this study, researchers looked at how the manufacturing technique used to create vapour grown carbon nanofiber (VGCNF)/rubbery epoxy composites affects the thermal conductivity, electrical conductivity and mechanical properties of the final product. Samples were produced by one of three methods: mechanical mixing (MM), three-roll ...
Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was determined that although thermal conductivity increased with increasing filler content, it was not necessarily due to the increased number of filler particles present, but rather ...
The transient plane source method was used to perform thermal conductivity, thermal diffusivity, and specific heat capacity measurements. Thermal transport properties of several thermal greases were characterized using TPS and data were compared to supplier data, received by other methods, to determine accuracy of the TPS method....
