Select Page

Keyword: electronic packaging

Total Papers Found: 4

Rheology and Thermal Conductivity of Diamond Powder-Filled Liquid Epoxy Encapsulants for Electronic Packaging 

Author(s): , , , , , ,

Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm ...

Keywords: , , , , , , ,

Read More

Effect of processing technique on the transport and mechanical properties of vapour grown carbon nanofibre/rubbery epoxy composites for electronic packaging applications

Author(s): , ,

Electronics packaging is fast paced area of research as scientists work to keep up with the new demands of smaller, more powerful electronic devices. In this study, researchers looked at ...

Keywords: , , , , , , , , , , ,

Read More

Effect of filler arrangement and networking of hexagonal boron nitride on the conductivity of new thermal management polymeric composites

Author(s): ,

Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce ...

Keywords: , , , , , , , , , , , ,

Read More

Rapid thermal conductivity measurement with a hot disk sensor: Part 2. Characterization of thermal greases


The transient plane source method was used to perform thermal conductivity, thermal diffusivity, and specific heat capacity measurements, using the hot disk sensors. Thermal transport properties of several thermal greases ...

Keywords: , , , , , ,

Read More

Pin It on Pinterest