In this paper, polyamide (PA, composed of at least 60% renewable materials) was used as a polymer matrix to prepare PA-hexagonal boron nitride (hBN) polymer composites with varying hBN contents. Two different PA samples were used in this study: a low viscosity grade PA (PA-30), as ...
Polyactic acid (PLA)-micro hexagonal boron nitride (hBN)-graphene nanoplatelet (GNP) polymer composites were prepared, and the effects of varying filler contents on the thermal and mechanical properties of the polymer composites were investigated. It was determined that the addition of the GNPs resulted in ...
As electronics get smaller and more powerful, the packaging that contains them must in turn become lighter with higher thermal conductivity and electrical resistivity. This study tested the effect of adding highly concentrated hexagonal boron nitride (hBN) fibers to liquid crystal polymer. The fibers were ...
This study was conducted to determine if highly expanded open cell polycarbonate foams (PC) could be used as thermal insulation among other characteristics of the foam. This was accomplished through testing the PC foam with the Transient Plane Source (TPS) method. Multiple relative densities of ...
Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was ...
