Thermal Conductivity Paper Database

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Recommended Papers for: Hani E. Naguib

Total Papers Found: 6

Thermal Composites of Biobased Polyamide with Boron Nitride Micro Networks

In this paper, polyamide (PA, composed of at least 60% renewable materials) was used as a polymer matrix to prepare PA-hexagonal boron nitride (hBN) polymer composites with varying hBN contents. Two different PA samples were used in this study: a low viscosity grade PA (PA-30), as ...

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High thermally conductive PLA based composites with tailored hybrid network of hexagonal boron nitride and graphene nanoplatelets

Polyactic acid (PLA)-micro hexagonal boron nitride (hBN)-graphene nanoplatelet (GNP) polymer composites were prepared, and the effects of varying filler contents on the thermal and mechanical properties of the polymer composites were investigated. It was determined that the addition of the GNPs resulted in ...

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Design of thermal hybrid composites based on liquid crystal polymer and hexagonal boron nitride fiber network in polylactide matrix

As electronics get smaller and more powerful, the packaging that contains them must in turn become lighter with higher thermal conductivity and electrical resistivity. This study tested the effect of adding highly concentrated hexagonal boron nitride (hBN) fibers to liquid crystal polymer. The fibers were ...

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Characterization of the structure, acoustic property, thermal conductivity, and mechanical property of highly expanded open-cell polycarbonate foams 

This study was conducted to determine if highly expanded open cell polycarbonate foams (PC) could be used as thermal insulation among other characteristics of the foam. This was accomplished through testing the PC foam with the Transient Plane Source (TPS) method. Multiple relative densities of ...

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Effect of filler arrangement and networking of hexagonal boron nitride on the conductivity of new thermal management polymeric composites

Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was ...

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