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In this paper, polyamide (PA, composed of at least 60% renewable materials) was used as a polymer matrix to prepare PA-hexagonal boron nitride (hBN) polymer composites with varying hBN contents. Two different PA samples were used in this study: a low viscosity grade PA (PA-30), as well as a high viscosity grade PA (PA-90). The composite polymers were tested to evaluate their thermal, physical, and mechanical properties. It was concluded that ...
Polyactic acid (PLA)-micro hexagonal boron nitride (hBN)-graphene nanoplatelet (GNP) polymer composites were prepared, and the effects of varying filler contents on the thermal and mechanical properties of the polymer composites were investigated. It was determined that the addition of the GNPs resulted in a decrease in thermal conductivity in comparison to a PLA-hBN composite unless the GNP:hBN ratio was 1:1, where the thermal conductivity was equal to that ...
As electronics get smaller and more powerful, the packaging that contains them must in turn become lighter with higher thermal conductivity and electrical resistivity. This study tested the effect of adding highly concentrated hexagonal boron nitride (hBN) fibers to liquid crystal polymer. The fibers were oriented in a way to achieve a high filler concentration, and the composites were then randomly added to a polyactide matrix. The researchers found that ...
This study was conducted to determine if highly expanded open cell polycarbonate foams (PC) could be used as thermal insulation among other characteristics of the foam. This was accomplished through testing the PC foam with the Transient Plane Source (TPS) method. Multiple relative densities of foam were tested, and it was found that the higher the relative density the higher the thermal conductivity, and vice versa. The lower the relative ...
Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was determined that although thermal conductivity increased with increasing filler content, it was not necessarily due to the increased number of filler particles present, but rather ...
