The thermal conductivity and thermal boundary resistance between ultrananocrystalline diamond (UNCD) and microcrystalline diamond (MCD) films on silicon wafers were evaluated. It was found that the MCD/Si composite wafers were more thermally conductive than the UNCD/Si wafers over the temperature range tested. It ...
As electronics get smaller and more powerful, the components within them that handle heat dissipation must also evolve. Increasing power density and rising hot spots must be accouted for and handled. In this PhD dissertation, the author studies materials for potential use as heat spreaders ...
