The thermal conductivity and thermal boundary resistance between ultrananocrystalline diamond (UNCD) and microcrystalline diamond (MCD) films on silicon wafers were evaluated. It was found that the MCD/Si composite wafers were more thermally conductive than the UNCD/Si wafers over the temperature range tested. It was also found that in both types of composite wafer, the thermal conductivity increased with temperature in contrast to the decrease that is observed in ...
