Thermal Conductivity Paper Database

Search academic papers below:

Recommended Papers for: composites

Total Papers Found: 58

Facile preparation of fracture-free pectin/clay aerogel monoliths

Clay aerogels are typically used for insulation, filtration and absorption, and are typically favored because of their eco-friendly nature, low density and high porosity. Unfortunately, these aerogels are limiting due to their relatively high fragility. Researchers in this study aimed to create fracture-free pectin/clay ...

Author(s): , ,

Thermal conductivity and thermal diffusivity of palm fiber reinforced binary phenolformaldehyde composites

Samples of binary reinforced composites were created by mixing varying fractions of palm fiber (20, 30, 40, and 50 weight %) in a phenoformaldehyde (PF) matrix. The thermal conductivity and thermal diffusivity were measured using Transient Plane Source equipment. The team discovered that the thermal conductivity and thermal diffusivity of ...

Author(s): , , , , ,

Preparation and thermal properties of porous heterogeneous composite phase change materials based on molten salts/expanded graphite

This article discussed the creation of phase change composite materials using molten binary salts and expanded graphite (EG). Three different salts were used, LiNO3–KCl, LiNO3–NaNO3 and LiNO3–NaCl. The amount of salt in the composites varied between 77.8% and 81.5%. The thermal conductivity of the ...

Author(s): , , , , ,

Effect of nanosized carbon black on the morphology, transport, and mechanical properties of rubbery epoxy and silicone composites

Rubber carbon black (CB)/rubbery epoxy (RE) and CB/silicone composites with different types, loadings, and silane functionalization of carbon black were prepared. These composites were investigated for their electrical conductivities, and their mechanical properties. The thermal conductivity of each composite was also determined using ...

Author(s): , , , ,

Rheology and Thermal Conductivity of Diamond Powder-Filled Liquid Epoxy Encapsulants for Electronic Packaging 

Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm resulted in a thermal conductivity of 4.1 W/m·K which is a substantial increase in ...

Author(s): , , , , , ,

Linkedin