Clay aerogels are typically used for insulation, filtration and absorption, and are typically favored because of their eco-friendly nature, low density and high porosity. Unfortunately, these aerogels are limiting due to their relatively high fragility. Researchers in this study aimed to create fracture-free pectin/clay aerogel monoliths. In this process, water was used as the solvent and montmorillonite as the solute. Morphologies, thermal stability and conductivity of the monoliths were ...
Samples of binary reinforced composites were created by mixing varying fractions of palm fiber (20, 30, 40, and 50 weight %) in a phenoformaldehyde (PF) matrix. The thermal conductivity and thermal diffusivity were measured using Transient Plane Source equipment. The team discovered that the thermal conductivity and thermal diffusivity of the composites decreased as the amount of palm fiber increased....
This article discussed the creation of phase change composite materials using molten binary salts and expanded graphite (EG). Three different salts were used, LiNO3–KCl, LiNO3–NaNO3 and LiNO3–NaCl. The amount of salt in the composites varied between 77.8% and 81.5%. The thermal conductivity of the products was assessed to determine how it was affected by the addition of expanded graphite. The researchers determined that they had increased the thermal conductivity ...
Rubber carbon black (CB)/rubbery epoxy (RE) and CB/silicone composites with different types, loadings, and silane functionalization of carbon black were prepared. These composites were investigated for their electrical conductivities, and their mechanical properties. The thermal conductivity of each composite was also determined using a thermal constants analyzer. It was determined that the incorporation of carbon black into the composites increased the thermal conductivity in all of the samples. ...
Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm resulted in a thermal conductivity of 4.1 W/m·K which is a substantial increase in comparison to the thermal conductivity of the pure epoxy. The electronic device junction temperature between a Si PiN diode chip and a 64 vol. % diamond-epoxy flowable ...
