Rheology and Thermal Conductivity of Diamond Powder-Filled Liquid Epoxy Encapsulants for Electronic Packaging
Author(s): Jian H. Zhao, Kuang Sheng, Leonid Fursin, W. Roger Cannon, Xiangyang Hu, Xiaohui Wang, Yongxi Zhang
Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm ...
Keywords: composites, Electronic Device Junction Temperature, electronic packaging, Epoxy, resin, Thermal Conductivity, viscosity
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