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Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm resulted in a thermal conductivity of 4.1 W/m·K which is a substantial increase in comparison to the thermal conductivity of the pure epoxy. The electronic device junction temperature between a Si PiN diode chip and a 64 vol. % diamond-epoxy flowable ...
The need for higher thermal conductivity fillers, such as aluminum nitride, to deal with an increase in the heat output from future semiconductors has arisen, as most of them are now packaged in a silica epoxy polymer composite. Thermal conductivity testing was performed on the aluminum nitride composite using a thermal constants analyzer and the highest reading was 3.39 W/mK, approximately 15 times higher than pure epoxy. Based on the results, ...
