Rheology and Thermal Conductivity of Diamond Powder-Filled Liquid Epoxy Encapsulants for Electronic Packaging 

Author(s): , , , , , ,

Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm ...

Keywords: , , , , , , ,

Read More