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Author(s): , , , , , ,

Keywords: , , , , , , ,

Abstract: Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm resulted in a thermal conductivity of 4.1 W/m·K which is a substantial increase in comparison to the thermal conductivity of the pure epoxy. The electronic device junction temperature between a Si PiN diode chip and a 64 vol. % diamond-epoxy flowable slip was measured at different power densities.

Reference: IEEE Transactions on Components and Packaging Technologies, 32, 4 (2009) 716-723

DOI: 10.1109/TCAPT.2009.2029701