Category: Transient Plane Source
Author(s): Jian H. Zhao, Kuang Sheng, Leonid Fursin, W. Roger Cannon, Xiangyang Hu, Xiaohui Wang, Yongxi Zhang
Keywords: composites, Electronic Device Junction Temperature, electronic packaging, Epoxy, resin, Thermal Conductivity, viscosity
Abstract: Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm resulted in a thermal conductivity of 4.1 W/m·K which is a substantial increase in comparison to the thermal conductivity of the pure epoxy. The electronic device junction temperature between a Si PiN diode chip and a 64 vol. % diamond-epoxy flowable slip was measured at different power densities.
Reference: IEEE Transactions on Components and Packaging Technologies, 32, 4 (2009) 716-723
DOI: 10.1109/TCAPT.2009.2029701