Category:

Author(s): , , ,

Keywords: , , , , , , , , , ,

Abstract: The point of this research paper was to modify the thermal and mechanical properties of epoxy resin (EP) via the addition of boron nitride (BN) by a silane coupling agent (KH550). The use of 60 wt.% BN resulted in a thermal conductivity that was 5 times higher than the conductivity of the unmodified epoxy resin.

Reference: Polymers for Advanced Technologies, 23, 6 (2012) 1025-1028

DOI: 10.1002/pat.2063