Category: Transient Plane Source
Author(s): Chao Xie, Jing Dang, Junwei Gu, Qiuyu Zhang
Keywords: BN, boron nitride, composites, Dielectric Constant, Dielectric Loss, EP, Epoxy, resin, Thermal Conductivity, Thermal Decomposition Temperature
Abstract: The point of this research paper was to modify the thermal and mechanical properties of epoxy resin (EP) via the addition of boron nitride (BN) by a silane coupling agent (KH550). The use of 60 wt.% BN resulted in a thermal conductivity that was 5 times higher than the conductivity of the unmodified epoxy resin.
Reference: Polymers for Advanced Technologies, 23, 6 (2012) 1025-1028