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Recommended Papers for: Qiuyu Zhang

Total Papers Found: 4

Significantly Enhanced and Precisely Modeled Thermal Conductivity in Polyimide Nanocomposites by Chemically Modified Graphene via in-situ Polymerization and Electrospinning-hot press Technology

Chemically modified graphene (CMG) was obtained by combining aminopropyllsobutyl polyhedral oligomeric silsesquioxane (NH2-POSS) and hydrazine monohydrate to functionalize graphene oxide (GO). CMG and polyimide (PI) were combined to create the CMG/PI nanocomposite. The properties of this nanocomposite were obtained using a variety of methods. The thermal conductivity measurements were performed using a TPS instrument by utilizing the transient plane source (TPS) method. It was found that the thermal ...

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Fabrication, proposed model and simulation predictions on thermally conductive hybrid cyanate ester composites with boron nitride fillers

In the present study, boron nitride/dicyclopentadiene bisphenol cyanate ester/bisphenol A dicyanate ester (BN/DCPDCE/BADCy) composites were investigated for the effects of filler mass on thermal and mechanical properties. Thermal conductivity was measured using an instrument by transient plane source method. With the addition of BN fillers for BN/DCPDCE/BADCy composites, the BN-BN connections of inner composites increased and formed more thermally conductive channels, resulting in improved ...

Author(s): , , , , , ,

Studies on the Preparation of Polystyrene Thermal Conductivity Composites

Through the use of thermally conductive fillers the thermal properties of polystyrene (PS) are improved significantly. The different fillers include: aluminum oxide (Al2O3), magnesium oxide (MgO), B-silicon carbide particles (B-SiCp),  and  B-silicon carbide whiskers (B-SiCw). The use of PS flakes resulted in higher thermal conductivities than the use of PS particles, and the use of  B-silicon carbide whiskers resulted in the most favorable thermal conductivity and resulted in a ...

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Thermal conductivity epoxy resin composites filled with boron nitride

The point of this research paper was to modify the thermal and mechanical properties of epoxy resin (EP) via the addition of boron nitride (BN) by a silane coupling agent (KH550). The use of 60 wt.% BN resulted in a thermal conductivity that was 5 times higher than the conductivity of the unmodified epoxy resin....

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