Compared to traditional epoxy, polybenzoxazine resins have improved thermal, mechanical, and electrical properties. In this article, spherical aluminum nitride (AIN) was studied as a filler in bisphenol A-aniline-based polybenzoxazine (poly(BA-a)). Thermal conductivity was obtained by transient plane source method. Thermal conductivity of each composite gradually increased with enhanced filler amount. Poly(BA-a)/AIN composites also had higher thermal conductivity than systems containing epoxy/AIN....
The point of this research paper was to modify the thermal and mechanical properties of epoxy resin (EP) via the addition of boron nitride (BN) by a silane coupling agent (KH550). The use of 60 wt.% BN resulted in a thermal conductivity that was 5 times higher than the conductivity of the unmodified epoxy resin....
Five different glasses were created in the present study with varying compositional ratios in a CaO-B2O2-SiO2 (CBS) System and the thermal and dielectric properties of these glasses were studied. A glass was found that had high thermal conductivity and promising dielectric properties, with a low sintering temperature that allows for the addition of fillers to adjust thermal and dielectric properties further....
