Thermal Conductivity Paper Database

Search academic papers below:

Recommended Papers for: Jing Dang

Total Papers Found: 1

Thermal conductivity epoxy resin composites filled with boron nitride

The point of this research paper was to modify the thermal and mechanical properties of epoxy resin (EP) via the addition of boron nitride (BN) by a silane coupling agent (KH550). The use of 60 wt.% BN resulted in a thermal conductivity that was 5 times higher ...

Author(s): , , ,