Thermal conductivity epoxy resin composites filled with boron nitride
Author(s): Chao Xie, Jing Dang, Junwei Gu, Qiuyu Zhang
The point of this research paper was to modify the thermal and mechanical properties of epoxy resin (EP) via the addition of boron nitride (BN) by a silane coupling agent (...
Keywords: BN, boron nitride, composites, Dielectric Constant, Dielectric Loss, EP, Epoxy, Hot Disk Instrument, resin, Thermal Conductivity, Thermal Decomposition Temperature
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