This article explored polymeric composites and their thermal characteristics, such as their high thermal conductivity and excellent thermal stability. These characteristics are highly desired as they can be widely applied in the electronics, medical, manufacturing, etc., industries. The thermal conductivities were studied using a variety of sources, including the transient plane source (TPS). After conducting several studies on the thermally conductive polymeric composites, it was determined that there were some ...
In the present study, boron nitride/dicyclopentadiene bisphenol cyanate ester/bisphenol A dicyanate ester (BN/DCPDCE/BADCy) composites were investigated for the effects of filler mass on thermal and mechanical properties. Thermal conductivity was measured using an instrument by transient plane source method. With the addition of BN fillers for BN/DCPDCE/BADCy composites, the BN-BN connections of inner composites increased and formed more thermally conductive channels, resulting in improved ...
The point of this research paper was to modify the thermal and mechanical properties of epoxy resin (EP) via the addition of boron nitride (BN) by a silane coupling agent (KH550). The use of 60 wt.% BN resulted in a thermal conductivity that was 5 times higher than the conductivity of the unmodified epoxy resin....