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Author(s): , , ,

Keywords: , , , , , , , , , , , , , , , , , , , , ,

Abstract: As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a Hot Disk TPS-2500 thermal constants analyzer measured the thermal conductivities of eight different epoxy resin thermal adhesives using the transient plane source (TPS) method. Results showed that the layer-structure fillers enhanced the thermal conductivity of the epoxy matrix the most, while the sharp corner-shaped fillers had the lowest impact on thermal conductivity. 

Reference: Applied Thermal Engineering, 66 (2014) 493-498

DOI: 10.1016/j.applthermaleng.2014.02.044