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Keyword: Thermal Adhesives

Total Papers Found: 2

Thermal conductivity enhancement with different fillers for epoxy resin adhesives

Author(s): , , ,

As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a Hot Disk TPS-2500 thermal constants analyzer measured ...

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Mathematical Methods for the Rapid Development of New High Performance Thermal Interface Materials

Author(s): , , ,

The development of higher power chips in the electronics industry has led to the requirement of high performance thermal interface materials (TIMs) due to the increased heat output by these ...

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