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Recommended Papers for: Yuan-Xiang Fu

Total Papers Found: 2

Thermal conductivity enhancement of epoxy adhesive using graphene sheets as additives

In this study, various filler loadings of thin graphite sheets were added to epoxy adhesives to improve thermal conductivity. Natural graphite powder and graphite nanoflakes were used as reference fillers in the same resin, and the thermal conductivity of each filler was measured with a TPS thermal constants analyzer based on the transient plane source (TPS) method. Results showed that the graphene sheets enhanced the thermal conductivity by more than 22 ...

Author(s): , , ,

Thermal conductivity enhancement with different fillers for epoxy resin adhesives

As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a thermal constants analyzer measured the thermal conductivities of eight different epoxy resin thermal adhesives using the transient plane source (TPS) method. Results showed that the layer-structure fillers enhanced the thermal conductivity of the epoxy matrix the most, while the sharp corner-shaped fillers had the lowest impact on ...

Author(s): , , ,