This article investigated the effects of silver addition to copper-aluminum (Cu-Al) alloys. These effects were studied by observing the microstructural, thermal, and mechanical properties of the alloy through a variety of methods. A Thermal Constant Analyzer was used to determine the thermal properties (specifically the thermal conductivities) of the alloys by implementing the transient plane source (TPS) method. From this method, it was found that the thermal conductivity and diffusivity ...
This study investigated new sol-gel methods in the fabrication of Al₂O₃ - SiO₂ composite aerogels. Compared to conventional methods, the Al₂O₃ - SiO₂ composite aerogels were prepared and mixed together. Thermal conductivity of the composite aerogels was measured by an instrument, using a transient plane heat source method....
As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a thermal constants analyzer measured the thermal conductivities of eight different epoxy resin thermal adhesives using the transient plane source (TPS) method. Results showed that the layer-structure fillers enhanced the thermal conductivity of the epoxy matrix the most, while the sharp corner-shaped fillers had the lowest impact on ...
A novel technique was used in this research article, to introduce a hybrid mesh to a polymer composite within bipolar plates, for proton exchange membrane fuel cells (PEMFCs). The mesh added was copper or aluminum based, to allow for an increased thermal conductivity of the PEMFCs. Experimental testing confirms this theory, as the copper-meshed hybrid polymer composite showed a thermal conductivity of 30.0 W/mK, while the aluminum-meshed hybrid polymer composite ...
In this study, researchers set out to determine the effects of embedding self-passivated aluminum fillers, of micro- and nano-meter size and various wt%, into a polyvinylidene fluoride matrix (Al*/PVDF). After testing, the results indicated an increase in thermal conductivity with the introduction of embedded self-passivated aluminum fillers. It was determined that the maximum thermal conductivity possible (3.258 W/mK) was achieved when the ratio of micro- to nano-sized particles was 20: 1, ...
