Category: Transient Plane Source
Author(s): Dong-Chuan Mo, Shu-Shen Lu, Yuan-Xiang Fu, Zhuo-Xian He
Keywords: aluminum, Aluminum oxide, boron nitride, Copper, Diamond, Epoxy, Fillers, graphite, Heat dispersion, Metals, Powder shape, Powders, resin, Scanning Electron Microscopy (SEM), Silver, Thermal Adhesives, Thermal Conductivity, thermal transport properties, Transient plane source (TPS), Transient plane source (TPS) method, Zinc oxide
Abstract: As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a thermal constants analyzer measured the thermal conductivities of eight different epoxy resin thermal adhesives using the transient plane source (TPS) method. Results showed that the layer-structure fillers enhanced the thermal conductivity of the epoxy matrix the most, while the sharp corner-shaped fillers had the lowest impact on thermal conductivity.
Reference: Applied Thermal Engineering, 66 (2014) 493-498
DOI: 10.1016/j.applthermaleng.2014.02.044