The purpose of this study was to analyze the thermal properties of metal hydride for its application in hydrogen storage systems. The thermal properties of metal hydride were measured using the Thermal Property Analyzer based on the transient plane source (TPS) method. To verify the accuracy of the TPS method, the thermal properties of stainless steel pellets were measured prior to the metal hydride samples. Unfortunately, the thermal behavior of ...
In this study, various filler loadings of thin graphite sheets were added to epoxy adhesives to improve thermal conductivity. Natural graphite powder and graphite nanoflakes were used as reference fillers in the same resin, and the thermal conductivity of each filler was measured with a TPS thermal constants analyzer based on the transient plane source (TPS) method. Results showed that the graphene sheets enhanced the thermal conductivity by more than 22 ...
The purpose of this study was to fabricate and analyze the physical properties of polyacrylate–gold nanocomposites (PGNs) with gold nanoparticles (GNPs) as their nucleation agents. The transient plane source (TPS) method was used to measure the thermal properties of the polyacrylate–gold nanocomposite foams (FPGNs) and PGNs. Results showed that the addition of GNPs improved thermal conductivity of the PGN materials, but as the size of GNPs increased, the ...
Diamond is an extremely conductive material that would be ideal for dissipating heat in microelectronics if it were not for its high price tag. In this study, cost effective copper- and chromium-diamond composites (uncoated (Cu/D), Cu-coated (Cu/CuD), and Cr-coated (Cu/CrD)) were produced to determine their potential use in heat sink applications. A Thermal Constant Analyzer measured the thermal conductivity of the matrix and composite samples using the ...
As nanotechnology becomes increasingly important, researchers are investigating methods to decrease the size of electronics. Carbon nanotubes (CNTs) have potential applications in nanoelectronics because of their high thermal conductivity and miniscule size. This study had many focuses, but a TPS used the transient plane source method to specifically measure the thermal conductivities of CNT-fabricated thermal pastes. Results showed that the thermal conductivities varied depending on filler content, but were comparable ...
