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In this study, sintering parameters in conventional pressure-less sintering are analyzed and the effects of uncoated, Cu(Ni)-coated, and Cr-coated diamond particles are compared for their bulk thermal conductivities. Thermal conductivity was measured at room temperature using a Thermal Constant Analyzer. The addition of diamond particles caused a decrease in the thermal conductivity due to facial air gaps in the composites....
Diamond is an extremely conductive material that would be ideal for dissipating heat in microelectronics if it were not for its high price tag. In this study, cost effective copper- and chromium-diamond composites (uncoated (Cu/D), Cu-coated (Cu/CuD), and Cr-coated (Cu/CrD)) were produced to determine their potential use in heat sink applications. A Thermal Constant Analyzer measured the thermal conductivity of the matrix and composite samples using the ...
