Category: Transient Plane Source
Author(s): Fazal Ahmad Khalid, Kabeer Raza, Muhammad Zain-ul-abdein, Tarek Mabrouki
Keywords: Coatings, Copper, Cu/D composites, Diamond, Hasselman-Johnson model, Temperature, Thermal Conductivity, Thermal management systems, Thermal Resistance, thermal transport properties, Transient plane source (TPS) method, Volume
Abstract: Diamond is an extremely conductive material that would be ideal for dissipating heat in microelectronics if it were not for its high price tag. In this study, cost effective copper- and chromium-diamond composites (uncoated (Cu/D), Cu-coated (Cu/CuD), and Cr-coated (Cu/CrD)) were produced to determine their potential use in heat sink applications. A Thermal Constant Analyzer measured the thermal conductivity of the matrix and composite samples using the transient plane source (TPS) method. Results showed that high diamond volume fractions were inversely related to thermal conductivities, whereas thermal conductivities increased with levels of copper and chromium coatings. Overall, a wide range of conductivities were obtained by coating diamond particles in conductive metals, and have potential applications in future microelectronics.
Reference: Materials and Design, 86 (2015) 248-258
DOI: 10.1016/j.matdes.2015.07.059