Epoxy nanocomposites containing thermally reduced graphene oxides (TRGs) with different oxygen contents were prepared and their mechanical and thermal properties were investigated. It was found that increasing the number of oxygen containing groups on the TRGs resulted in reduced agglomeration of the graphene oxides within the epoxy matrix. Therefore, in samples with a higher oxygen content, a higher interfacial contact area is present between the organic and inorganic phases in ...
The effects of silver nanowire size on the thermal conductivities of ethylene glycol-based nanofluids were investigated experimentally. The effects of altering the loading concentration of nanowires, and altering the temperature were also investigated. In addition to this, an investigation into the effects of the nanowire dimensions on the rheological properties of the nanofluids was also conducted. Theoretical models were then developed based on the experimental results....
The potential of graphene and few-layer graphene to be used as fillers in a paraffin wax phase change material (PCM) was evaluated. The goal was to prepare a composite PCM with a higher thermal conductivity than the pure paraffin wax. The ability of the composite PCM to reduce temperature variation in lithium ion batteries was also evaluated over 10 charging – discharging cycles. It was found that ...
The effective thermal conductivity and thermal diffusivity was measured for chalcogenide glass samples of the formulation Ge30-xSe70Sbx (x = 10, 15, 20, 25). It was found that both the effective thermal conductivity and thermal diffusivity were independent of temperature up to 160º C. After this point, both properties were found to increase with increasing temperature until they reached a maximum value at a point near the glass transition temperature of the glass. After reaching ...
The thermal conductivity and thermal boundary resistance between ultrananocrystalline diamond (UNCD) and microcrystalline diamond (MCD) films on silicon wafers were evaluated. It was found that the MCD/Si composite wafers were more thermally conductive than the UNCD/Si wafers over the temperature range tested. It was also found that in both types of composite wafer, the thermal conductivity increased with temperature in contrast to the decrease that is observed in ...
