Copper powder was used a filler and added to a polyamide matrix in order to generate copper reinforced polyamide composites. The copper powder came in three different forms: short fibers, plates and spheres. The short fibers were added to the polyamide matrix at a vol.% up to 30, and the plates and spheres up to 60 vol.%. Thermal conductivity was measured and it was found that at filler amounts below 10 vol.% the ...
Three different carbons (carbon black, synthetic graphite particles and carbon fiber) were added to Vectra A950RX Liquid Crystal Polymer in order to synthesize different composites for use in fuel cells. The carbon fillers were used individually and also in combination with other carbon fillers. A TPS was used to measure the thermal conductivities of the synthesized composites. It was found that the use of synthetic graphite particles as the ...
The addition of graphene nanoplatelets (GNP) to a paraffin-based solvent, eicosane was performed at various wt.% and subsequently the synthesized GNP/eicosane composites were analyzed by a variety of machines. The characterization of the GNP/eicosane composites was performed by the TPS technique for the measurement of thermal conductivity from 10°C to 35°C. At a wt.% of 10 GNP filler the composite had a thermal conductivity four times that of unfilled ...
The present study look at the creation of unfilled and carbon nanofibre (CNF)-filled polypropylene (PP) foams, and their subsequent testing of thermal and mechanical properties. The testing of thermal properties was accomplished by the TPS Technique and determined that when using up to 20 wt.% CNF as filler there was no increase in thermal conductivity of any of the sample foams. Therefore it was decided that it was the foamed ...
Through the use of thermally conductive fillers the thermal properties of polystyrene (PS) are improved significantly. The different fillers include: aluminum oxide (Al2O3), magnesium oxide (MgO), B-silicon carbide particles (B-SiCp), and B-silicon carbide whiskers (B-SiCw). The use of PS flakes resulted in higher thermal conductivities than the use of PS particles, and the use of B-silicon carbide whiskers resulted in the most favorable thermal conductivity and resulted in a ...