Category: Transient Plane Source
Author(s): Dilek Kumlutas, H. Serkan Tekce, Ismail H. Tavman
Keywords: Copper, Filler Content, Fillers, Particle Shape, particle size, Polyamide Composites, Polymer composites, spatial arrangement, Thermal Conductivity
Abstract: Copper powder was used a filler and added to a polyamide matrix in order to generate copper reinforced polyamide composites. The copper powder came in three different forms: short fibers, plates and spheres. The short fibers were added to the polyamide matrix at a vol.% up to 30, and the plates and spheres up to 60 vol.%. Thermal conductivity was measured and it was found that at filler amounts below 10 vol.% the three different copper fillers produced similar experimental results. At filler amounts above 10 vol.% the short fiber copper particles led to a rapid increase in thermal conductivity. Thermal conductivity of the composite is proportional to filler shape, size and thermal conductivity and volume fraction.
Reference: Journal of Reinforced Plastics and Composites, 26, 1 (2007) 113-121