Category: Transient Plane Source
Abstract: Through the use of thermally conductive fillers the thermal properties of polystyrene (PS) are improved significantly. The different fillers include: aluminum oxide (Al2O3), magnesium oxide (MgO), B-silicon carbide particles (B-SiCp), and B-silicon carbide whiskers (B-SiCw). The use of PS flakes resulted in higher thermal conductivities than the use of PS particles, and the use of B-silicon carbide whiskers resulted in the most favorable thermal conductivity and resulted in a thermal conductivity six times higher than that of regular polystyrene. The experimental results were also compared to values predicted by the Maxwell-eucken model.
Reference: Polymer-Plastics Technology and Engineering, 49, 3 (2010) 1385-1389