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Abstract: Through the use of thermally conductive fillers the thermal properties of polystyrene (PS) are improved significantly. The different fillers include: aluminum oxide (Al2O3), magnesium oxide (MgO), B-silicon carbide particles (B-SiCp),  and  B-silicon carbide whiskers (B-SiCw). The use of PS flakes resulted in higher thermal conductivities than the use of PS particles, and the use of  B-silicon carbide whiskers resulted in the most favorable thermal conductivity and resulted in a thermal conductivity six times higher than that of regular polystyrene. The experimental results were also compared to values predicted by the Maxwell-eucken model.

Reference: Polymer-Plastics Technology and Engineering, 49, 3 (2010) 1385-1389

DOI: 10.1080/03602559.2010.512326