As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a thermal constants analyzer measured the thermal conductivities of eight different epoxy resin thermal adhesives using the transient plane source (TPS) method. Results showed that the layer-structure fillers enhanced the thermal conductivity of the epoxy matrix the most, while the sharp corner-shaped fillers had the lowest impact on ...
The authors have developed a method for the functionalization of single-walled carbon nanotubes (SWCNTs). The functionalization of the SWCNTs is useful in helping to produce a better dispersion of nanotubes throughout a polymer matrix. Better dispersion of nanotubes was thought to result in an improvement in the mechanical, electrical, and thermal properties of nanocomposite polymers. It was determined that the method produced effective surface modification of the nanotubes. The elastic ...
Nanocomposites of polyaniline nanofibers reinforced in epoxy were prepared and their ultrasonic velocities, ultrasonic attenuations, and thermal conductivities were measured over a temperature range of 298-373 K. It was found that the ultrasonic velocity decreased with increasing temperature, but increased with increasing concentration of polyaniline nanofibers in the epoxy matrix. These two trends were opposite for the ultrasonic attenuation, and the thermal conductivity was found to increase with increasing temperature ...
Carbon fiber and magnetite (Fe3O4)-doped epoxy memory shape polymers were prepared with 2.5% volume fraction of each dopant. These materials were doped in the hope of increasing the thermal performance of the polymers. Using the Thermal Constants Analyzer, thermal conductivity, thermal diffusivity and specific heat of the doped polymers were measured. Specifically, the researchers were looking into changes exhibited near the transition temperature of the shape memory polymer of ...
Thermal interface resistance results from small gaps and surface geometry mismatches between two materials that make up a composite. Thermal interface resistance is present in most any material that is comprised of two or more components. In the field of thermal interface materials, the majority of novel materials are composites, and thus are subject to thermal interface resistance and thermal boundary resistance (thermal discontinuity at a perfectly bonded interface of ...
