As electronic devices become smaller, power densities increase and so do hotspot temperatures, leading to a need for materials that can exchange heat better. The materials that facilitate this heat exchange are called thermal interface materials (TIMs). Graphene has been shown to demonstrate superior thermal conductivity and a particular form called few-layer graphene (FLG) was used in this project. A novel TIM was created by the mixing of a silver ...
Boron Nitride filled epoxy composites are explored on a thermal and mechanical scale within this research article. Researchers took special interest in the effect of filler content, mixing conditions and Boron Nitride agglomerate size, on the thermal conductivity of the composite. Experimental results alluded to an increase in thermal conductivity, as filler content, and mixing speed, time and temperature increased. On the other hand, as the Boron Nitride agglomerate size ...
The purpose of this research was to improve the thermal conductivity of boron-nitride filled epoxy composites. To complete this task, the interfacial adhesion in the composite needed to be improved. This was achieved by employing admicellar polymerization to coat the polystyrene and polymethyl methacrylate, on the boron nitride surface. The results indicated an increase in the thermal conductivity of the composite from 1.5 W/mK, with the use of untreated boron-nitride, ...
In this research, the effect of four different coupling agents on the thermal conductivity of an aluminum particle reinforced epoxy composite, was studied. The results concluded that with an increasing concentration of aluminum particles in the epoxy, an increase in the thermal conductivity of the composite was noted. Prior to being treated with the coupling agents, the composites experienced a thermal conductivity reading of 1.03 W/mK. Post treatment, the thermal ...
As technology advances, the need for inexpensive polymer-based composites possessing high thermal conductive properties has become more and more important. Previously, the addition of thermal conductive particles, such as alumina, boron nitride and alumina nitride, has caused an increase in the thermal conductivity of the composite. Although an increase in thermal conductivity is present, an increase in fabrication costs is also experienced as a higher quantity of particles is required, ...
