Thermal Conductivity Paper Database

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Recommended Papers for: Hsin Wang

Total Papers Found: 6

Thermally conductive MgO-Filled Epoxy Molding Compounds

Despite their tendencies to have low thermal conductivities, epoxy molding compounds (EMCs) are extensively used in automotive applications. In this study, magnesium oxide (MgO) was used as a conductive filler in ECMs to improve the thermal conductivity of the ECMs without altering other important characteristics. ...

Author(s): , , , , , ,

Thermal conductivity measurements of Kaolite

The purpose of this study was to measure the thermal conductivity of cementitious Kaolite 1600 for its potential to replace the radioactive materials in ES-2 containers. A thermal constants analyzer measured the thermal conductivity of the Kaolite samples using the transient plane source (TPS) method. Results ...

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G-Plus report to Owens Corning thermal conductivity measurements of fiberglass

Fiberglass is used inside car mufflers as a noise reducer and insulator. The insulating properties of the fiberglass eliminates the need for muffler heat shields, however to properly design vehicles without heat shields, it is important to know the thermal conductivity of fiberglass at high ...

Author(s): , ,

Thermal Conductivity of IONSIV IE-911 Crystalline Silicotitanate and Savannah River Waste Simulant Solutions

This government report discusses the possibility of using crystalline silicotitanate (CST) as a method of removing cesium from radioactive waste tanks at a storage facility. Thermal conductivity is an important factor in this process as cesium emits thermal energy, the solution used to remove it ...

Author(s): , ,

Experimental and numerical study of the effective thermal conductivity of nano composites with thermal boundary resistance

Thermal interface resistance results from small gaps and surface geometry mismatches between two materials that make up a composite. Thermal interface resistance is present in most any material that is comprised of two or more components. In the field of thermal interface materials, the majority ...

Author(s): , , ,

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