Effective surface treatments for enhancing the thermal conductivity of BN-filled epoxy composite
Author(s): H. Manuspiya, K. Wattanakul, N. Yanumet
The purpose of this research was to improve the thermal conductivity of boron-nitride filled epoxy composites. To complete this task, the interfacial adhesion in the composite needed to be improved. ...
Keywords: admiceller polymerization process, boron nitride, Epoxy, interfacial adhesion, molar ratio, monomer, poly(methyl methacrylate), Polymer composites, polystrene, resin, SEM micrographs, silane treatment, solubility parameter concept, surface modification, surfactant, Thermal Conductivity, wettability
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