Category: Transient Plane Source
Author(s): C. T. Sun, Hsin Wang, R. B. Dinwiddie, Rushabh Kothari
Keywords: Epoxy, Equation, H-J, Hasselman-Johnson's, Hasselman-Johnson's (H-J) Equation, nanocomposites, Nanoparticles, resin, Silica, Thermal Boundary Resistance, Thermal Conductivity, thermal interface materials, Thermal Interface Resistance, TIMs, TPS Method, TPS Technique
Abstract: Thermal interface resistance results from small gaps and surface geometry mismatches between two materials that make up a composite. Thermal interface resistance is present in most any material that is comprised of two or more components. In the field of thermal interface materials, the majority of novel materials are composites, and thus are subject to thermal interface resistance and thermal boundary resistance (thermal discontinuity at a perfectly bonded interface of two different materials). Silica nanoparticles embedded in epoxy resin are studied and the thermal conductivity is measured using a TPS machine, and from these values the thermal boundary resistance can be calculated using Hasselman-Johnson's (H-J) equation.
Reference: International Journal of Heat and Mass Transfer, 66 (2013) 823-829
DOI: 10.1016/j.ijheatmasstransfer.2013.07.061