Epoxy resin/silicon carbide (Ep/SiC) composites were prepared by the casting method and subsequently characterized for their mechanical and thermal properties. It was determined that an increasing mass fraction of SiC in the epoxy resin resulted in increasing thermal conductivity of the composites. Using 50 wt.% SiC resulted in a thermal conductivity of 0.7152 W/mK, which is three times that of pure epoxy resin. Mechanical properties peaked with 10 wt.% SiC. ...
The point of this research paper was to modify the thermal and mechanical properties of epoxy resin (EP) via the addition of boron nitride (BN) by a silane coupling agent (KH550). The use of 60 wt.% BN resulted in a thermal conductivity that was 5 times higher than the conductivity of the unmodified epoxy resin....
Four different cationic surfactants were allowed to adsorb on boron nitride (BN) over the pH range of 5.5 to 8 in separate experiments. The authors talk about the orientation of the surfactant relative to the BN particles. The use of these surfactants has changed the partial ionic surface of BN to a hydrophobic surface, which also led to an increase in thermal conductivity and more favourable mechanical properties....
This study looked at the use of two different fillers to improve the thermal properties of an epoxy resin. The two fillers were multi-walled carbon nanotubes (MWCNTs) and aluminum nitride (AlN). Through the use of poly(glycidyl methacrylate) (PGMA) and a zirconate coupling agent the MWCNTs and AlN particles respectively were added to the epoxy resin. Through the use of 1 vol.% MWCNT and 25 vol.% AlN the researchers were able to ...
The authors observed a remarkable synergistic effect when they used multi-graphene platelets (MGPs) and multi-walled carbon nanotubes (MWCNTs) together in an epoxy composite. The use of these two fillers together increased the tensile strength, thermal conductivity, solubility and compatibility relative to the various individual components. The 1D nanotubes inhibit the aggregation/stacking of the platelets and thus result in high contact area between MGP/MWCNT and the polymer matrix....
