Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was determined that although thermal conductivity increased with increasing filler content, it was not necessarily due to the increased number of filler particles present, but rather ...
Polyether Ether Ketone (PEEK)/hexagonal boron nitride (h-BN) nanocomposites were formed by a planetary ball milling process and hot compression molding in order to determine the effect of the addition of h-BN on the properties of PEEK. In particular, the tensile strength, friction and wear behaviors, morphology, hardness, thermomechanical properties, and thermal conductivity of the nanocomposite were examined. Hexagonal boron nitride was added in filler concentrations of up to 5 wt. %. ...
The development of environmentally sustainable materials for use in the management of heat in electronics is becoming increasingly important. Currently the majority of materials that are used for this purpose are oil-based. In this article, the thermal transport, physical, electrical, and mechanical properties of a bio-based polymer matrix (polyactic acid) with embedded hexagonal boron nitride were studied to determine if this would be a practical material for use in the ...
Ultrathin boron nitride nanosheets (BNNSs) were prepared at 300°C by a new variable-pressure one-step synthesis. An increase in pressure during the synthesis results in a decreased thickness for the nanosheets, which were all triangular in shape with zig-zag edges. The synthesized nanosheets exhibit high adsorption capacities for the organic dye methylene blue (MB). In addition to these properties, the BN nanosheets can be used as excellent thermal-conducting additives in BN-polymer ...
The point of this research paper was to modify the thermal and mechanical properties of epoxy resin (EP) via the addition of boron nitride (BN) by a silane coupling agent (KH550). The use of 60 wt.% BN resulted in a thermal conductivity that was 5 times higher than the conductivity of the unmodified epoxy resin....
