Category: Transient Plane Source
Author(s): A. Rybak, A. Siwek, B R. Sekula, Cz. Kapusta, K. Gaska
Keywords: boron nitride, Epoxy, Epoxy Composites, Epoxy resins, Thermal Conductivity, Transient plane source (TPS) method
Abstract: Thermal conductivity of neat-epoxy resin is one of the lowest among all known solid materials. A common method of increasing thermal conductivity is through the addition of filler particles with high thermal conductivity. In this study, epoxy resin composites were studied to assess the possibility of increasing thermal conductivity for effective heat dissipation. A typical industrial liquid epoxy was used with commercial boron nitride powders PT100 and PTX25 as fillers. Epoxy resin samples were filled with powder at 5%, 10%, 15%, 20%, 25%, and 30% by volume fraction.
Reference: European Conference on Composite Materials (EECM): 15, 2012
DOI: N/A