Category: Hot Disk TPS
Abstract: Thermal conductivity of neat-epoxy resin is one of the lowest among all known solid materials. A common method of increasing thermal conductivity is through the addition of filler particles with high thermal conductivity. In this study, epoxy resin composites were studied to assess the possibility of increasing thermal conductivity for effective heat dissipation. A typical industrial liquid epoxy was used with commercial boron nitride powders PT100 and PTX25 as fillers. Epoxy resin samples were filled with powder at 5%, 10%, 15%, 20%, 25%, and 30% by volume fraction. Thermal conductivity was measured with the Hot Disc Thermal Constant Analyser TPS 500, and it was observed that thermal conductivity increased with filler content.
Reference: European Conference on Composite Materials (EECM): 15, 2012