Category: Hot Disk TPS
Keywords: BN, boron nitride, differential scanning calorimetry, Differential scanning calorimetry (DSC), DSC, Effective Thermal Conductivity, Electrical Conductivity, Electrical Impedance, hardness, Hot Disk Transient Plane Source Method, Impact Test, Polymer composites, Rheological Properties, TGA, thermal expansion, Thermo Gravimetric Analysis, Thermo Gravimetric Analysis (TGA)
Abstract: In this paper, polyamide (PA, composed of at least 60% renewable materials) was used as a polymer matrix to prepare PA-hexagonal boron nitride (hBN) polymer composites with varying hBN contents. Two different PA samples were used in this study: a low viscosity grade PA (PA-30), as well as a high viscosity grade PA (PA-90). The composite polymers were tested to evaluate their thermal, physical, and mechanical properties. It was concluded that these composites had more favourable properties than other polymers that had been previously tested, and so the composites would be a good choice as an electronic packaging material.
Reference: Journal of Polymers and the Environment, 23, 4 (2015) 566-579